Fabricating Inner Channels in Laser Additive Manufacturing Process via Thin-Plate-Preplacing Method

نویسندگان

چکیده

This paper presents a hybrid manufacturing process for the preparation of complex cavity structure parts with high surface quality. Firstly, laser precision packaging technology is utilized to accurately connect thin plate substrate microchannel. Secondly, Direct Metal Laser-Sintering (DMLS) completely shape part. The morphology and microstructure encapsulated specimens DMLS molded were investigated. results show that can form good metallurgical bond. lowest roughness was 1.18 μm. perpendicularity between top microchannel side wall optimal when power 240 W. Consequently, effectively solves problems poor quality powder sticking closed inner cavities. method eliminates defects adhesive in microchannel, improves finish, problem mechanical tools cannot be processed inside which lays foundation research high-quality process.

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ژورنال

عنوان ژورنال: Materials

سال: 2023

ISSN: ['1996-1944']

DOI: https://doi.org/10.3390/ma16196406